[01] Neda Rakhshandeh, Department of Chemical Engineering, Sirjan Science and Research Branch, Islamic Azad University, Sirjan, Iran; Department of Chemical Engineering, Sirjan Branch, Islamic Azad University, Sirjan, Iran. [02] Farshad Farahbod, Department of Chemical Engineering, Firoozabad Branch, Islamic Azad University, Firoozabad, Iran.

Over the past decade, heat pipe use in electronic cooling applications has increased dramatically, primarily in notebook computers. In fact, virtually every notebook computer manufactured today uses at least one heat pipe assembly. Utilization of copper and aluminum wick type in one 18 cm copper heat pipe is considered in this experimental study. Water is used as working fluid. The purpose of performed experiments is to investigate the role of wick type in heat transfer parameters and define the difference between performances of heat pipe using these two different materials as wick at the identical operation conditions. Also, the effect of different values of input power on thermal characteristics of heat pipe is investigated.

Heat Pipe, Wick, Heat Transfer, Nusselt, Peclet, Thermal Performance

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